Electronic Solutions
DuPont™ Pyralux® Performance
“Enabling next-generation flexible electronics with high-performance laminates engineered for speed, reliability, and extreme environments.”
All Polyimide solutions
Reference
PYRALUX® AC
PYRALUX® AG
PYRALUX® AP
PYRALUX® APR
PYRALUX® HT
PYRALUX® HP
PYRALUX® ML
Description
Adhesive type
UL-94
MOT °C
CCL
Coverlay
Bondply
Sheet Adhesive
All-polyimide single sided cast-on-copper adhesiveless copper-clad composite made of polyimide and copper foil.
Adhesiveless
V-0
155
All-polyimide double sided copper-clad autocalved laminates.
Adhesiveless
V-0
130
All-polyimide double sided copper-clad autocalved laminates.
Adhesiveless
V-0
200
Laminate adhesiveless, all-polyimide in combination with TCR® Thin-Film Embedded Resistor Copper Foil from Ticer Technologies
Adhesiveless
Unique all polyimide cover film or bonding material, becomes a flexible coverlay after processing.
All PI
V-0
200
Epoxy based unsupported adhesive formulated for high-speed high-frequency flexible circuit applications, with low values on Dk and Df .
Adhesiveless
DuPont’s Kapton® polyimide laminates cladded with one or two sides Constantan alloy foil, CuNi44.
Acrylic based adhesive solutions
Reference
PYRALUX® LF
PYRALUX® FR
Description
Adhesive type
UL-94
MOT °C
CCL
Coverlay
Bondply
Sheet Adhesive
Complete line of Kapton® polyimide CCL, coverlays coated on one or both sides and cast adhesive films.
modified acrylic
200
Complete line of Kapton® polyimide CCL, coverlays coated on one or both sides and cast adhesive films.
proprietary flame retardant ULVTM0 acrylic
V-0
200
Fluoropolymer adhesive solutions
DuPont™ Pyralux® TK is a PTFE/polyimide composite double sided CCL and bondply ideal enabling remarkable signal integrity in high speed digital and high frequency flex and rigid-flex applications where Dk must fall below 3.0.
Reference
PYRALUX® TK
Description
Adhesive type
UL-94
MOT °C
CCL
Coverlay
Bondply
Sheet Adhesive
Low Dk PTFE/PI composite double sided CCL and bondply
PTFE based
V-0
200
AGC Ceramic Filled PTFE Base Material
“Delivering advanced thermal and electrical stability through precision-engineered ceramic-filled PTFE materials for high-frequency performance.”
Product Name
NF-30
RF-10
RF-30A
RF-35HTC
RF-35TC
RF-60TC
TLF-35A
TLY-5Z
TSM-DS3
TSM-DS3b
TSM-DS3M
Description
DK
DF
TG (°C)
TC (W/mK)
IPC Slash Sheet
Ceramic-filled PTFE composites without woven fiberglass reinforcement
3.0 +/- 0.04
0.0013
N/A
0.5
4103A/230
Low loss, high DK material
10.2 +/- 0.3
0.0025
N/A
0.85
4103A/280
High volume antenna material
2.97 +/- 0.05
0.002
N/A
0.42
4103A/230
High thermal conductivity laminate
3.5 +/- 0.05
0.0007
N/A
1.84
4103A/240
Thermally conductive low loss laminate
3.5 +/- 0.05
0.002
N/A
0.92
4103A/240
High DK, high thermal conductivity material
6.15 +/- 0.15
0.002
N/A
1.05
4103A/270
Low cost PA base material
3.5 +/- 0.05
0.0026
N/A
0.37
4103A/240
Low DK, low Z axis laminate
2.2 +/- 0.04
0.0015
N/A
0.2
4103A/200
Dimensionally stable low loss laminate
3.0 +/- 0.05
0.0014
N/A
0.65
4103A/230
Dimensionally stable low loss laminate
3.0 +/- 0.04
0.0014
N/A
0.65
4103A/230
Dimensionally stable low loss laminate
2.94 +/- 0.04
0.0014
N/A
0.65
4103A/230
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Recover valuable metals that can be refined and reused in new applications.
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Our processes emphasize environmental responsibility, reducing landfill waste and minimizing ecological impact.
Trusted Expertise
With proven know-how in handling complex waste streams, we deliver safe, efficient, and compliant recovery services.
Partner for Sustainability
By working with us, you not only enhance your bottom line but also strengthen your company’s commitment to green practices.
Key Features
Transform your industrial waste into a profitable and sustainable resource with CEM ENGRG.
Transform your industrial waste into a profitable and sustainable resource with CEM ENGRG.