Advanced Materials
Nano Conductive Copper Paste
“Where thermal performance, adhesion strength, and process versatility unite to elevate modern semiconductor packaging.”
Application: Adhesion
- Diverse dispensing, and excellent effect on printing, regardless of dispensing / spray process could be application.
- After being cured, no deformation as temperature increasing.
- No solvent, could solve dry out issue.
- The issue of fillet height of Rough Leadframe could be solved.
Proper Equipment
- dispensing: Match up EFD / MUSASHI packaging.
- printing: stencil / screen
- Spin Coating: equipment of spin coating
Application
IC chip package(QFN/SOP/SSOP/SIP/INSOP/AQFN)
Leadframe, LED package, various metal material adhesion
IC chip package
Leadframe (Copper Clip) adhesion
LED package
various metal material adhesion
Semiconductor High Purity Hexachlorodisilane (HCD)
General Specification
Assey (%)
≥ 99.5
ShelfLife Time (Month)
Na
Mg
Al
K
Ti
Cr
Mn
Fe
Ni
Cu
(ppb)
12
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
H20
ppm
Carbon
SiCl4
ppm
%
Reference Value
Semiconductor High Purity Grade Liquefied Hydrogen Chloride
Application: Liquefied hydrogen chloride is used in epitaxial processes for semiconductor manufacturing.
Items
1
HCL
2
O2
3
N2
4
CO2
5
H2O
6
Al
7
As
8
B
9
Bi
10
Cd
11
Cr
12
Cu
13
Fe
14
Na
15
Ni
16
P
17
Pb
18
Sb
19
Zn
Unit
Specification
%
≥ 99.999
ppm
≤ 1
ppm
≤ 1
ppm
≤ 1
ppm
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 3
ppb
≤ 5
ppb
≤ 2
ppb
≤ 5
ppb
≤ 2
ppb
≤ 1
ppb
≤ 5
Semiconductor Chip Dicing Cleaning Fluid
Application: YNK-708 dicing fluid is specifically developed for various wafer dicing processes. It effectively removes silicon dust and prevents electrochemical corrosion of bond pads during the dicing process.
Semi-Aqua Bio-Cleaner
Application: 1139X is a Halide/Halogenated solvent free new performance Semi-Aqua bio-cleaner formulated to remove post assemblies flux residues soldered with rosin-based or no-clean solder-paste fluxes. It is also an excellent all-purpose cleaner and degreaser, compatible to be used for rosin-based and no-clean and organic acid flux. This cleaner has high solvency ideal for assemblers who want to remove assemblies flux residues using a more environmentally friendly safer solvent, replacing more toxic Chlorinated/Halogenated solvent.
Physical Properties
Appearance
Specific Gravity @25°C
pH
Boiling point
Flash Point
Parameters
Straw liquid
1.01 ± 0.01
10.0
110°C
None to boiling point
Maximize Returns
Recover valuable metals that can be refined and reused in new applications.
Eco-Friendly Solutions
Our processes emphasize environmental responsibility, reducing landfill waste and minimizing ecological impact.
Trusted Expertise
With proven know-how in handling complex waste streams, we deliver safe, efficient, and compliant recovery services.
Partner for Sustainability
By working with us, you not only enhance your bottom line but also strengthen your company’s commitment to green practices.