“Where thermal performance, adhesion strength, and process versatility unite to elevate modern semiconductor packaging.”
IC chip package(QFN/SOP/SSOP/SIP/INSOP/AQFN)
Leadframe, LED package, various metal material adhesion
This is our highest grade phosphoric acid, for which the level of particles that are fine contaminants has been reduced. Particles sticking to the surface of semiconductor wafers can cause defects in the semiconductor manufacturing process. By reducing impurities to the absolute minimum, this product can be used as an etching agent for semiconductors, which are sensitive to particles.
Etching electronic materials
Plastic container (25kg,30kg), Drum (300kg), Tank truck load (10t)
(Packaging options for EL-S grade)
0.2 µm/ml
0.3 µm/ml
0.5 µm/ml
General Standard
200 or less
70 or less
20 or less
Assey (%)
≥ 99.5
ShelfLife Time (Month)
Na
Mg
Al
K
Ti
Cr
Mn
Fe
Ni
Cu
(ppb)
12
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
≤ 20
H20
ppm
Carbon
SiCl4
ppm
%
Reference Value
Application: Liquefied hydrogen chloride is used in epitaxial processes for semiconductor manufacturing.
Items
1
HCL
2
O2
3
N2
4
CO2
5
H2O
6
Al
7
As
8
B
9
Bi
10
Cd
11
Cr
12
Cu
13
Fe
14
Na
15
Ni
16
P
17
Pb
18
Sb
19
Zn
Unit
Specification
%
≥ 99.999
ppm
≤ 1
ppm
≤ 1
ppm
≤ 1
ppm
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 1
ppb
≤ 3
ppb
≤ 5
ppb
≤ 2
ppb
≤ 5
ppb
≤ 2
ppb
≤ 1
ppb
≤ 5
Application: YNK-708 dicing fluid is specifically developed for various wafer dicing processes. It effectively removes silicon dust and prevents electrochemical corrosion of bond pads during the dicing process.
Application: 1139X is a Halide/Halogenated solvent free new performance Semi-Aqua bio-cleaner formulated to remove post assemblies flux residues soldered with rosin-based or no-clean solder-paste fluxes. It is also an excellent all-purpose cleaner and degreaser, compatible to be used for rosin-based and no-clean and organic acid flux. This cleaner has high solvency ideal for assemblers who want to remove assemblies flux residues using a more environmentally friendly safer solvent, replacing more toxic Chlorinated/Halogenated solvent.
Physical Properties
Appearance
Specific Gravity @25°C
pH
Boiling point
Flash Point
Parameters
Straw liquid
1.01 ± 0.01
10.0
110°C
None to boiling point

Recover valuable metals that can be refined and reused in new applications.

Our processes emphasize environmental responsibility, reducing landfill waste and minimizing ecological impact.

With proven know-how in handling complex waste streams, we deliver safe, efficient, and compliant recovery services.

By working with us, you not only enhance your bottom line but also strengthen your company’s commitment to green practices.